Lv6
2030 积分 2024-07-05 加入
Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading
17天前
已完结
Parallel microLED-based optical links with record data rates and low power consumption
22天前
已完结
Wide and parallel LED-based optical links using multi-core fiber for chip-to-chip communications
22天前
已完结
High speed light microLEDs for visible wavelength data communication
22天前
已完结
High-Speed Micro-LEDs Based on Nano-Engineered InGaN Active Region Towards Chip-to-Chip Interconnections
22天前
已完结
304 channel MicroLED based CMOS transceiver IC with aggregate 1 Tbps and sub-pJ per bit capability
22天前
已完结
Fabrication of microlens arrays on curved substrates for large viewing angle integral imaging 3D display
24天前
已完结
Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package
2个月前
已完结
Effect of simulation methodology on solder joint crack growth correlation
2个月前
已完结
Scaling effects on the microstructure and thermomechanical response of through silicon vias (TSVs)
3个月前
已完结
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