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2400 积分 2024-07-05 加入
Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading
3个月前
已完结
Parallel microLED-based optical links with record data rates and low power consumption
3个月前
已完结
Wide and parallel LED-based optical links using multi-core fiber for chip-to-chip communications
3个月前
已完结
High speed light microLEDs for visible wavelength data communication
3个月前
已完结
High-Speed Micro-LEDs Based on Nano-Engineered InGaN Active Region Towards Chip-to-Chip Interconnections
3个月前
已完结
304 channel MicroLED based CMOS transceiver IC with aggregate 1 Tbps and sub-pJ per bit capability
3个月前
已完结
Fabrication of microlens arrays on curved substrates for large viewing angle integral imaging 3D display
3个月前
已完结
Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package
5个月前
已完结
Effect of simulation methodology on solder joint crack growth correlation
5个月前
已完结
Scaling effects on the microstructure and thermomechanical response of through silicon vias (TSVs)
6个月前
已完结
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