Lv610
1800 积分 2024-07-05 加入
Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package
2天前
已完结
Effect of simulation methodology on solder joint crack growth correlation
7天前
已完结
Scaling effects on the microstructure and thermomechanical response of through silicon vias (TSVs)
1个月前
已完结
The effect of wax on the properties of epoxy molding compound
1个月前
已完结
Design, Process, and Reliability of Wafer Level Packaging
1个月前
已完结
Correlation between flow mark and internal structure of thin PC/ABS blend injection moldings
1个月前
已完结
Effect of overmolding process on the integrity of electronic circuits
1个月前
已完结
Theoretical analysis of fiber coupling and image transmission for flexible micro-LED near-eye displays
2个月前
已完结
Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs
2个月前
已完结
Control of adhesion force for micro LED transfer using a magnetorheological elastomer
2个月前
已完结
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