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XIAO玉
Lv1
40 积分
2023-09-13 加入
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Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures
9天前
已完结
Recent Advances and Trends in Advanced Packaging
2个月前
已完结
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
2个月前
已完结
Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures
2个月前
已完结
Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management
2个月前
已完结
A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces
2个月前
已完结
Heat transfer characteristics of thermal energy storage system using single and multi-phase cooled heat sinks: A review
2个月前
已完结
GaN-on-diamond materials and device technology: A review
2个月前
已完结
An effort in planarising microwave plasma CVD grown polycrystalline diamond (PCD) coated 4in. Si wafers
4个月前
已完结
Growth behavior of IMCs in Sn–1.0Ag–0.5Cu–xBi/Ni joints during isothermal aging
4个月前
已完结
没有进行任何应助
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2个月前
感谢,点赞,速度真快,么么哒
2个月前
速度真快
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asp[e1【积分已退回】
4个月前
感谢,帮大忙了,速度真快
6个月前
找到了【积分已退回】
7个月前
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8个月前
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8个月前
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