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100 积分 2024-11-29 加入
Optimization of embedded cooling for hotspots based on compound plate thermal spreading model
13小时前
已完结
激光器芯片烧结用AuSn薄膜焊料制造技术研究
5个月前
已完结
Steady-State Thermal Analysis of a GaN-Based Semiconductor Laser
5个月前
已完结
Advances in high power InAlGaAs/InP-based semiconductor lasers
5个月前
已完结
Densification mechanism and surface mechanical failure evolution of complex silver nanoparticle interconnection interface via pressure-assisted forced bonding
6个月前
已关闭
Scalable production of ultraflat and ultraflexible diamond membrane
6个月前
已完结
Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging
6个月前
已完结
Extending low‐temperature sintering technique to large‐sized whole‐wafer power semi‐conductor devices
6个月前
已完结
Thermal Boundary Conductance Enhancement of the Si/Diamond Interface via Atomic Transition Strategy
10个月前
已完结
MPCVD diamond-SiC composite stacks for enhanced thermal performance: a concise review
10个月前
已完结
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