Lv4
490 积分 2022-10-20 加入
Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions
2个月前
已完结
Simulation research on wafer warpage and internal stress in the First Passivation process of eSiFO package
3个月前
已完结
3-D Structure Design and Reliability Analysis of Wafer Level Package With Stress Buffer Mechanism
3个月前
已完结
Integrated Fan‐Out (InFO) for High Performance Computing
4个月前
已完结
A Comprehensive Simulation Study of Warpage of Fan-out Panel-level Package using Element Birth and Death Technique
5个月前
已完结
Advanced Thermal Lid Attach Adhesive for High Performance Computing (HPC) Package
6个月前
已完结
Advanced Packaging Technology Platforms for Chiplets and Heterogeneous Integration
6个月前
已完结
Optimal thermo-mechanical reliability design of 2.5D lidless package
6个月前
已完结
Comparative Analysis of Temperature-induced Micro-scale Deformation of Package by Experiment and Finite Element Analysis
6个月前
已完结
鄂公网安备 42011102003731号
