Lv4
440 积分 2022-10-20 加入
The Optimization of FCBGA thermal Design by Micro Pattern Structure
7个月前
已关闭
Reliability and Benchmark of 2.5D Non-Molding and Molding Technologies
10个月前
已完结
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
1年前
已完结
Statistical analysis of tin whisker growth
1年前
已完结
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth
1年前
已完结
High Density Multi-Chip Embedded Panel-Level Packaging Integration Technology
1年前
已完结
Wafer level compression molding compounds
1年前
已完结
Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System
1年前
已完结
Failure Analysis
1年前
已完结
Thermal Modeling of 2.5D Integrated Package of CMOS Image Sensor and FPGA for Autonomous Driving
1年前
已完结
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