Lv1
2 积分 2026-03-15 加入
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
17小时前
待确认
Self-driven manifold microchannel heat sink for cooling electronics
1天前
已完结
Structure-enabled liquid manipulation: bioinspired control across all dimensions
2天前
已完结
Sustainable vaporization for electronics cooling via dynamic fluid delivery
3个月前
已完结