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10 积分 2026-03-27 加入
Optical and Electrical Characterization of a Compact Universal Photonic Engine
22天前
已完结
Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies
23天前
已完结
Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips
23天前
已完结
Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review
23天前
已完结
Scaling EMIB—A Comprehensive Architecture Portfolio for Localized Interconnects
23天前
已完结
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
23天前
已完结
CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage
25天前
已完结
EMIB and advanced substrate packaging technologies to enable heterogeneous integration (HI) applications
25天前
已完结
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