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Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array
23天前
已完结
Design of anti-unwinding attitude coupling controller for flexible spacecraft using positive position feedback control
23天前
已完结
Design and optimization of cell and multiple-zone gradient modulation field limiting ring(MGM-FLR) termination for 1700V/10A 4H-SiC merged PiN/Schottky (MPS) Diodes
1个月前
已完结
Effect of Er and Ni-CNTs on the interfacial reaction and growth behavior of Sn58Bi/Cu intermetallic compound layers
1个月前
已完结
Study on the failure mechanism and characteristics of electrochemical migration of electronic package structures in humid environment
1个月前
已完结
A Critical Assessment of graphene based heat pipes for electronics and power module cooling applications
1个月前
已完结
新型植物免疫激活蛋白维大力(VDAL)对小麦抗逆及产量的影响
2个月前
已完结
Multi-Layer Microchannel Cooling for Large-Area High-Power Electronics
2个月前
已完结
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