Lv1
2 积分 2026-03-31 加入
A Miniaturized Integrated System for Embedded Microchannel Cooling with Manifolds
6天前
已完结
A comparative numerical study on two-phase boiling fluid flow and heat transfer in the microchannel heat sink with different manifold arrangements
1个月前
已完结
Integrated embedded cooling method for thermal management in multilayer ceramic circuit substrate microsystems for multi-chip components
1个月前
已完结
A hybrid pump-driven phase-change cooling system incorporating capillary evaporation and liquid-gas ejection for thermal management of high-heat-flux chip arrays
1个月前
已完结
Liquid-Cooled Heat Dissipation Technology for Co-Packaged Optics over 12.8 Tbps
1个月前
已完结
Multi-objective optimization of a hybrid microchannel heat sink combining manifold concept with secondary channels
1个月前
已完结
Embedded microchannel enabling efficient thermoelectric cooler for high-heat-flux hotspot
1个月前
已完结
Embedded Microfluidic Cooling in Aluminum Nitride HTCC Substrate for High-Power Radio Frequency Chip Array
2个月前
已完结
Design of anti-unwinding attitude coupling controller for flexible spacecraft using positive position feedback control
2个月前
已完结
Design and optimization of cell and multiple-zone gradient modulation field limiting ring(MGM-FLR) termination for 1700V/10A 4H-SiC merged PiN/Schottky (MPS) Diodes
3个月前
已完结
皖公网安备34019202002308
