Lv5
1022 积分 2024-07-04 加入
Investigation of the effects of byproduct components in Cu plating for advanced interconnect metallization
4个月前
已完结
Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications
6个月前
已完结
Proceedings of 2nd International Conference on Micro-Electronics, Electromagnetics and Telecommunications
6个月前
已关闭
A simplified wearable device powered by a generative EMG network for hand-gesture recognition and gait prediction
7个月前
已完结
A highly conformal electrical bioadhesion interface via in situ gelation for electromyographic signal monitoring
9个月前
已完结
Enhancing Supercapacitor Performance: Synergistic 1T/2H-MoS2@Ti3C2Tx Hybrid as an Efficient Electrode Material for Asymmetric Supercapacitor Applications
10个月前
已关闭
MXene-Based Microneedle Electrode for Brain-Computer Interfacein Diverse Scenarios
10个月前
已完结
Ultrafast formation of topological defects in a two-dimensional charge density wave
10个月前
已完结
Electroplating (ECP) entry related defect improvement study
10个月前
已完结
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