Lv2
120 积分 2025-09-03 加入
Study the deformation behavior of Cu-Fe laminated composite using the experimental characterization and crystal plasticity finite element modeling
5天前
待确认
Three-dimensional simulation of intermetallic compound layer growth in a binary alloy system
3个月前
已完结
Growth kinetics of Cu–Sn intermetallic compounds at the interface of a Cu substrate and 42Sn–58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints
4个月前
已完结
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