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Sharon
Lv1
30 积分
2023-09-21 加入
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On-Chip Power Delivery and Management
1个月前
已完结
Summarization of Intra /Inter Chip Wireless Interconnection Technology
1个月前
已完结
Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink
3个月前
已完结
A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
3个月前
已完结
Effect of via depth on the TSV filling process for different current densities
3个月前
已完结
Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC
4个月前
已完结
Liquid Cooling for Thermal Management of Data Centers
5个月前
已完结
Thermal Isolation and Cooling Technologies for Heterogeneous 3D‐ and 2.5D‐ICs
5个月前
已完结
Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets
5个月前
已完结
Electrolyte Solvation Structure Design for Sodium Ion Batteries
6个月前
已完结
Nickel Nitride Particles Supported on 2D Activated Graphene–Black Phosphorus Heterostructure: An Efficient Electrocatalyst for the Oxygen Evolution Reaction
7个月前
已采纳
速度真快
5个月前
感谢,速度真快
7个月前
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