Lv2
160 积分 2023-09-21 加入
Unlocking the true potential of 3D CPUs with micro-fluidic cooling
7个月前
已完结
Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves
9个月前
已完结
Thermal performance and entropy generation of single‐layer and double‐layer constructal Y‐shaped bionic microchannel heat sinks
10个月前
已完结
On-Chip Power Delivery and Management
1年前
已完结
Summarization of Intra /Inter Chip Wireless Interconnection Technology
1年前
已完结
Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink
1年前
已完结
A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
1年前
已完结
Effect of via depth on the TSV filling process for different current densities
1年前
已完结
Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC
1年前
已完结
Liquid Cooling for Thermal Management of Data Centers
1年前
已完结
皖公网安备34019202002308
