Lv31
210 积分 2023-09-21 加入
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
1小时前
已完结
Inverse design of microchannel fluid flow networks using Turing pattern dehomogenization
2个月前
已完结
Unlocking the true potential of 3D CPUs with micro-fluidic cooling
1年前
已完结
Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves
1年前
已完结
Thermal performance and entropy generation of single‐layer and double‐layer constructal Y‐shaped bionic microchannel heat sinks
1年前
已完结
On-Chip Power Delivery and Management
1年前
已完结
Summarization of Intra /Inter Chip Wireless Interconnection Technology
1年前
已完结
Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink
1年前
已完结
A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure
1年前
已完结
Effect of via depth on the TSV filling process for different current densities
1年前
已完结
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