Lv1
46 积分 2023-10-07 加入
Self‐Wrinkling‐Induced Mechanically Adaptive Patterned Surface of Photocuring Coating for Abrasion Resistance
23小时前
待确认
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
1天前
已完结
Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging
1天前
已完结
Mesoporous hollow silica with controlled particle size for optimizing dielectric properties and coefficient of thermal expansion of polyimide packaging materials
1天前
已完结
Optimizing dielectric, mechanical, and thermal properties of epoxy resin through molecular design for multifunctional performance
1天前
已完结
Fluorine-Free Amphiphilic Copolymers for Broad-Spectrum Marine Biofouling Deterrence
1个月前
已完结
Fluorine-Free Amphiphilic Copolymers for Broad-Spectrum Marine Biofouling Deterrence
1个月前
已关闭
Highly Sensitive Cationic Photoresist for High‐Throughput Two‐Photon Nanofabrication
3个月前
已完结
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
3个月前
已完结
Solvent-free high-performance photocurable 3D printing resin from a noncoplanar branched maleimide oligomer for high-resolution fabrication
3个月前
已完结
皖公网安备34019202002308
