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20 积分 2025-03-27 加入
In situ observation of microstructure evolution in low-melting Bi–In–Sn alloys by light microscopy
2个月前
已完结
Thermodynamic re-optimisation of the Bi–In–Sn system based on new experimental data
2个月前
已完结
Microstructures and shear properties of antimony- and indium-strengthened Sn5Bi/Cu joints
2个月前
已完结
Ni and Sb improve the microstructure, mechanical properties, and solder joint reliability of Sn-3.0Ag-0.5Cu alloy
3个月前
已完结
Anchoring sulfur migration to mitigate Kirkendall voids in nano-twinned copper interconnections for robust and reliable packaging
3个月前
已完结
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers
5个月前
已完结
Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint
5个月前
已完结
The Microstructure and Mechanical Property of the High Entropy Alloy as a low Temperature Solder
7个月前
已完结
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