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Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties
55分钟前
待确认
Modeling and numerical simulations of dendritic crystal growth
2个月前
已完结
Phase-field model for binary alloys
2个月前
已完结
Modeling and numerical simulations of dendritic crystal growth
2个月前
已完结
In situ observation of microstructure evolution in low-melting Bi–In–Sn alloys by light microscopy
5个月前
已完结
Thermodynamic re-optimisation of the Bi–In–Sn system based on new experimental data
5个月前
已完结
Microstructures and shear properties of antimony- and indium-strengthened Sn5Bi/Cu joints
5个月前
已完结
Ni and Sb improve the microstructure, mechanical properties, and solder joint reliability of Sn-3.0Ag-0.5Cu alloy
5个月前
已完结
Anchoring sulfur migration to mitigate Kirkendall voids in nano-twinned copper interconnections for robust and reliable packaging
6个月前
已完结
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers
8个月前
已完结
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