Lv4
460 积分 2023-09-14 加入
Influence of argon hydrogen plasma treatment on the wettability, void and high temperature reflow reliability of indium thermal interface material for FCBGA package
1个月前
已完结
Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate
2个月前
已完结
Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders
2个月前
已完结
Theoretical investigation of HER/OER/ORR catalytic activity of single atom-decorated graphyne by DFT and comparative DOS analyses
2个月前
已完结
Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material
2个月前
已完结
Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method
2个月前
已完结
Investigation of fiber orientation states in injection‐compression molded short‐fiber‐reinforced thermoplastics
2个月前
已完结
Highly thermal conductive polymer composites via constructing micro-phragmites communis structured carbon fibers
2个月前
已完结
The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging
2个月前
已完结
2017 International Conference on Electronics Packaging (ICEP)
2个月前
已关闭
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