Lv41
460 积分 2023-09-14 加入
Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate
9小时前
待确认
Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi–Ag composite solders
9小时前
待确认
Theoretical investigation of HER/OER/ORR catalytic activity of single atom-decorated graphyne by DFT and comparative DOS analyses
9小时前
待确认
Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material
9小时前
待确认
Fabrication of aligned carbon-fiber/polymer TIMs using electrostatic flocking method
9小时前
待确认
Investigation of fiber orientation states in injection‐compression molded short‐fiber‐reinforced thermoplastics
9小时前
待确认
Highly thermal conductive polymer composites via constructing micro-phragmites communis structured carbon fibers
10小时前
待确认
The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging
10小时前
已完结
2017 International Conference on Electronics Packaging (ICEP)
10小时前
求助中
Performance of Thermal Interface Materials
10小时前
已完结
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