Lv1
28 积分 2026-01-30 加入
Junction temperature in light-emitting diodes assessed by different methods
1天前
待确认
Thermal characterization of multi-chip light emitting diodes with thermal resistance matrix
12天前
已完结
Structural optimization and numerical thermal analysis of ultraviolet light-emitting diodes with high-power multi-chip arrays
26天前
已完结
Thermal management in color variable multi-chip led modules
29天前
已完结
Implementation of Side Effects in Thermal Characterization of RGB Full-Color LEDs
29天前
已完结
Thermal Performance of AlN-Coated High-Power LED Optimized Using Taguchi Statistical Approach
4个月前
已完结
Reliability of Power Electronic Systems: An Industry Perspective
5个月前
已完结
A review on thermal management of light-emitting diodes: From package-level to system-level
6个月前
已完结
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
6个月前
已完结
A review on thermal management of light-emitting diodes: From package-level to system-level
6个月前
已完结
皖公网安备34019202002308
