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Reliability of Power Electronic Systems: An Industry Perspective
18天前
已完结
A review on thermal management of light-emitting diodes: From package-level to system-level
1个月前
已完结
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
1个月前
已完结
A review on thermal management of light-emitting diodes: From package-level to system-level
1个月前
已完结
Fabrication-Induced Warpage Characterization Analysis of Micro LED Fan-Out Packaging
1个月前
已完结
A review on thermal management of light-emitting diodes: From package-level to system-level
1个月前
已完结
Low temperature produced calcium-doped zinc oxide thick film via screen printing technique as thermal interface material in LED application
3个月前
已完结
Influence of composition ratio on the thermal performance of AlNB nanocomposite for an efficient heat spreading in solid-state lighting package (LED)
3个月前
已完结
Growth and performance analysis of BAlN alloy thin film on Al substrate as a heat spreader for effective thermal management applications on white-based high-power LED
3个月前
已完结
Zn thin film on Al metal as thermal substrates for LED application: thermal and optical performance
3个月前
已完结
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