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44 积分 2025-08-09 加入
Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density
21小时前
已完结
Thermal analysis of an enclosed charging module with a heat pipe-based independent air duct cooling system
22小时前
求助中
Two-phase immersion cooling system with integrated condenser for power module cooling in EV applications
22小时前
已完结
Thermal analysis and structural optimization for SiC power modules based on thermal-fluid coupling
25天前
已完结
Thermal analysis and structural optimization for SiC power modules based on thermal-fluid coupling
1个月前
已完结
Achieving robust and low thermal resistance polycrystalline diamond-Si integration by ultra-thin film AuIn bonding
1个月前
已完结
Enhanced thermal performances of high-power LED by diamond packaging
1个月前
已完结
Development of high heat dissipation insulated metal substrates using thin insulating films
2个月前
已完结
Design of a Novel Double Sided Cooling SiC Power Module Based on Multiple DBC-Stacked
2个月前
已关闭
Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles
2个月前
已完结
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