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90 积分 2025-08-09 加入
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
58分钟前
待确认
A DBC-stacked H-bridge SiC power module with optimized electro-thermal performance
18小时前
已完结
A 6–18 GHz High Power-Handling Switch in GaN Technology
3个月前
已完结
Thermal characterization of a ceramic baseplate-less 10 kV SiC MOSFET power module
3个月前
已完结
ANALYSIS OF LAMINAR MIXED CONVECTION IN AN INCLINED SQUARE LID-DRIVEN CAVITY WITH A NANOFLUID BY USING AN ARTIFICIAL NEURAL NETWORK
10个月前
已关闭
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