Lv1
70 积分 2025-08-09 加入
Development of high heat dissipation insulated metal substrates using thin insulating films
16天前
已完结
Design of a Novel Double Sided Cooling SiC Power Module Based on Multiple DBC-Stacked
1个月前
已关闭
Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles
1个月前
已完结
Flow boiling of HFE-7100 for cooling Multi-Chip modules using manifold microchannels
1个月前
已完结
An Enhanced Cooling Method for Power Modules on All-Electric Ships Based on Parameter Optimization and Special-Shaped Design of Sintered Heat Pipes
1个月前
已完结
Microstructure and thermal performance of lotus-type porous Cu/solder composite joints
1个月前
已完结
Highly thermal conductive graphene-based heatsink tailored for electric propulsion SiC-based inverter
1个月前
已完结
Experimental, numerical and multi-objective optimization study of novel multi-layer manifold microjet array for high power SiC modules cooling
1个月前
已完结
Development of a loop heat pipe for passive cooling of inverters in electric vehicles
1个月前
已完结
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
1个月前
已完结
皖公网安备34019202002308
