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1020 积分 2025-04-27 加入
Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime
2个月前
已完结
Review of Inorganic Non-metallic Materials in Power Electronics Packaging Application
2个月前
已完结
Machine-learning potentials for nanoscale simulations of tensile deformation and fracture in ceramics
2个月前
已完结
Fabrication of electrical semi-conductive SiCN ceramics by vat photopolymerization
2个月前
已完结
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
2个月前
已完结
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
2个月前
已完结
Machine-learning potentials for nanoscale simulations of tensile deformation and fracture in ceramics
2个月前
已完结
Scalable alloy-based sputtering of high-conductivity PdCoO2 for advanced interconnects
2个月前
已完结
Engineering of uniform anisotropic interconnection system with polyimide films for flexible electronics
2个月前
已关闭
Fabrication of electrical semi-conductive SiCN ceramics by vat photopolymerization
2个月前
已完结
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