Lv11
54 积分 2025-03-12 加入
Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent
9个月前
已完结
Copper submicron particle pastes with organic compounds as anti-oxidative additive for Cu-Cu bonding in air
9个月前
已完结