Lv5
1010 积分 2024-12-12 加入
Effect of pad size on shear strength and microstructure of LED solder joints
3个月前
已完结
Compliant Parallel-Guiding Mechanisms
6个月前
已完结
Design, Analysis, Experimentation, and Control of a Partially Compliant Bistable Mechanism
6个月前
已完结
Design and analysis of a 3-DOF planar micromanipulation stage with large rotational displacement for micromanipulation system
6个月前
已完结
Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs
7个月前
已完结
Research on Au-In Flip-Chip Bonding Process of 2300 PPI Micro-LED Arrays
7个月前
已完结
Application of laser‐assisted bonding in micro‐LED display technology
7个月前
已完结
Hybrid Bonding Process for Fabricating Micro-LED Based on the Au–In/Nonphotosensitive PI System
7个月前
已完结
Self-Assembled Size-Tunable Microlight-Emitting Diodes Using Multiple Sapphire Nanomembranes
7个月前
已完结
Design and testing of a high precision parallel manipulator with hyperbolic–elliptic flexure hinges
7个月前
已完结
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