Lv1
42 积分 2023-07-31 加入
Low-loss interconnects for modular superconducting quantum processors
2个月前
已完结
Packaging and integration of silicon carbide power devices
3个月前
已完结
Advancements and challenges of digital twins in industry
4个月前
已完结
System technology co-optimization for advanced integration
4个月前
已完结
The heterogeneous integration of electronic components
4个月前
已完结
Integrating silicon photonics with complementary metal–oxide–semiconductor technologies
5个月前
已完结
Comparison of Different Cooling Schemes for AlGaN/GaN High-Electron Mobility Transistors
5个月前
已完结
System technology co-optimization for advanced integration
7个月前
已完结
Advanced packaging of chiplets for future computing needs
7个月前
已完结
The development of thermal interface materials
7个月前
已完结
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