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22 积分 2023-07-31 加入
Packaging and integration of silicon carbide power devices
3天前
已完结
Advancements and challenges of digital twins in industry
17天前
已完结
System technology co-optimization for advanced integration
19天前
已完结
The heterogeneous integration of electronic components
26天前
已完结
Integrating silicon photonics with complementary metal–oxide–semiconductor technologies
1个月前
已完结
Comparison of Different Cooling Schemes for AlGaN/GaN High-Electron Mobility Transistors
1个月前
已完结
System technology co-optimization for advanced integration
3个月前
已完结
Advanced packaging of chiplets for future computing needs
3个月前
已完结
The development of thermal interface materials
3个月前
已完结
When do people prefer to be asked or told? The interplay between participative/directive advising style and expertise superiority in recommendation acceptance
4个月前
已完结
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