Lv5
910 积分 2023-07-26 加入
Novel low-loss resin coated copper and core material for advanced IC packags
6个月前
已完结
Low Loss BT resin for substrates in 5G communication module
6个月前
已完结
Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates
6个月前
已完结
Synthesis and application of epoxy resins: A review
8个月前
已完结
Description of the Resin Curing Process—Formulation and Optimization
8个月前
已完结
皖公网安备34019202002308
