Lv5
910 积分 2023-07-26 加入
Novel low-loss resin coated copper and core material for advanced IC packags
10个月前
已完结
Low Loss BT resin for substrates in 5G communication module
10个月前
已完结
Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates
10个月前
已完结
Synthesis and application of epoxy resins: A review
1年前
已完结
Description of the Resin Curing Process—Formulation and Optimization
1年前
已完结
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