Lv4
460 积分 2022-09-07 加入
Heterogeneous Integration in Co-Packaged Optics
1个月前
已完结
Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities
1个月前
已完结
Silicon Photonics Platform for Next Generation Data Communication Technologies
5个月前
已完结
EPIC-BOE: An Electronic-Photonic Chiplet Integration Technology with IC Processes for Broadband Optical Engine Applications
5个月前
已完结
Detachable Optical Chiplet Connector for Co-Packaged Photonics
6个月前
已完结
High-Speed TSV Integration in an Active Silicon Photonics Interposer Platform
6个月前
已完结
Micromirror fabrication for co-packaged optics using 3D nanoimprint technology
6个月前
已完结
Scalable Fabrication of 3D Optical Re-distribution for Co-Packaged Optics using an Developed Nanoimprint Stepper
6个月前
已完结
Flip-Chip Photonic-Electronic Integration Platform for Co-Packaged Optics Using a Glass Substrate with Vertically-Coupled Beam Expanding Lens
6个月前
已完结
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