Lv6
2060 积分 2024-06-28 加入
Atomic Layer Deposition of Ru for Replacing Cu-Interconnects
27天前
已完结
Selective ALD Mo Deposition in 10nm Contacts
1个月前
已完结
ALD Mo for Advanced MOL Local Interconnects
1个月前
已完结
Impact of chemical bonding difference of ALD Mo on SiO2 and Al2O3 on the effective work function of the two gate stacks
1个月前
已完结
Impact of chemical bonding difference of ALD Mo on SiO2 and Al2O3 on the effective work function of the two gate stacks
1个月前
已完结
A Three Dimensional DRAM (3D DRAM) Technology for the Next Decades
1个月前
已完结
Memory Technology 2021: Trends & Challenges
1个月前
已完结
Advanced 2T0C DRAM Technologies for Processing-in-Memory—Part II: Adaptive Layer-Wise Refresh Technique
1个月前
已完结
Advanced 2T0C DRAM Technologies for Processing-in-Memory—Part I: Vertical Transistor on Gate (VTG) DRAM Cell Structure
1个月前
已完结
Co capping layers for Cu/low-k interconnects
2个月前
已完结
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