Lv11
64 积分 2025-10-17 加入
In-situ reduction enabled anti-oxidation sintering of copper paste in air for power module packaging
1小时前
待确认
Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging
1个月前
已完结
Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package
2个月前
已完结
Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading
2个月前
已完结
A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading
2个月前
已完结
Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints
2个月前
已完结
Pressureless silver paste low-temperature sintering behavior and reliability analysis for large-size (≥100 mm2) chip interconnection in power devices
2个月前
已完结
Microstructural evolution and degradation mechanism of sintered silver joints on Ni/Ag/Cu substrates during high-temperature aging
2个月前
已完结
Effect of substrate surface roughness and parameters on the behavior of Cu nanoparticles sintering: A study by molecular dynamics simulation
3个月前
已完结
State-of-the-art review on energy and load forecasting in microgrids using artificial neural networks, machine learning, and deep learning techniques
3个月前
已完结
皖公网安备34019202002308
