Lv2
120 积分 2025-10-17 加入
Reliability evaluation of a CoWoS-enabled 3D IC package
27天前
已完结
Optimized Crosstalk and Impedance Design for HBM3 Channels in InFO
28天前
已完结
Optimized Signal and Power Integrity of Silicon Interposer for HBM2E in CoWoS Packaging
29天前
已完结
A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing
30天前
已完结
CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
30天前
已完结
Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging
1个月前
已完结
Microstructural and mechanical anisotropy in pressure-assisted sintered copper nanoparticles
2个月前
已关闭
A phase-field model of thermo-elastic coupled brittle fracture with explicit time integration
2个月前
已完结
Dynamic and adaptive mesh-based graph neural network framework for simulating displacement and crack fields in phase field models
2个月前
已完结
Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores
2个月前
已完结
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