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50 积分 2025-10-17 加入
Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles
1个月前
已完结
Large-area sintering of nano-copper for power module packaging and thermal-shock reliability
1个月前
已完结
In-situ reduction enabled anti-oxidation sintering of copper paste in air for power module packaging
1个月前
已完结
Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging
3个月前
已完结
Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package
3个月前
已完结
Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading
3个月前
已完结
A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading
3个月前
已完结
Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints
3个月前
已完结
Pressureless silver paste low-temperature sintering behavior and reliability analysis for large-size (≥100 mm2) chip interconnection in power devices
4个月前
已完结
Microstructural evolution and degradation mechanism of sintered silver joints on Ni/Ag/Cu substrates during high-temperature aging
4个月前
已完结
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