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56 积分 2025-10-17 加入
Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package
12小时前
待确认
Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading
12小时前
已完结
A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading
3天前
已完结
Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints
3天前
已完结
Pressureless silver paste low-temperature sintering behavior and reliability analysis for large-size (≥100 mm2) chip interconnection in power devices
23天前
已完结
Microstructural evolution and degradation mechanism of sintered silver joints on Ni/Ag/Cu substrates during high-temperature aging
27天前
已完结
Effect of substrate surface roughness and parameters on the behavior of Cu nanoparticles sintering: A study by molecular dynamics simulation
1个月前
已完结
State-of-the-art review on energy and load forecasting in microgrids using artificial neural networks, machine learning, and deep learning techniques
1个月前
已完结
Porosity effect on the mechanical properties of nano-silver solder
2个月前
已完结
Phase field simulation of powder bed-based additive manufacturing
2个月前
已完结
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