Lv3
300 积分 2025-09-16 加入
Reducing stripping force in ultrasonic-assisted exfoliation of laser-modified 4H-SiC wafers
26天前
已关闭
Crack propagation mechanisms in laser slicing of 4° off-axis 4H-SiC and separation strength regulation via multi-beam processing
7个月前
已完结
Ultrasonic-assisted stripping of single-crystal SiC after laser modification
8个月前
已完结
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