Lv3
300 积分 2025-09-16 加入
Reducing stripping force in ultrasonic-assisted exfoliation of laser-modified 4H-SiC wafers
1个月前
已关闭
Crack propagation mechanisms in laser slicing of 4° off-axis 4H-SiC and separation strength regulation via multi-beam processing
8个月前
已完结
Ultrasonic-assisted stripping of single-crystal SiC after laser modification
8个月前
已完结