Lv4
434 积分 2025-10-05 加入
Investigation of the removal mechanism of unidirectional C/SiC under scratching by single diamond grain
2天前
待确认
Modelling and grinding characteristics of unidirectional C–SiCs
2天前
已完结
Modeling of grinding forces and anisotropic damage in single abrasive grain 2D ultrasonic vibration-assisted grinding of Cf/SiC composites
2天前
求助中
Surface damage mechanism and modes in single abrasive grinding twill carbon fiber-reinforced-polymer laminates basing on stress field analysis
2天前
求助中
Removal mechanism and damage evolution of Cf/Al composites based on single-diamond-grain grinding
2天前
已完结
Research on Damage Characteristics of Ultrasonic Vibration-Assisted Grinding of a C/SIC Composite Material
2天前
已完结
Critical chip formation depth in PEEK and its short fiber-reinforced composites grinding: Mechanism and modeling
2天前
已完结
Study on the Microscopic Fiber Damage Mechanism in Carbon Fiber Reinforced Polymer during Single-Grain Scratching
2天前
已完结
Investigation of the material removal mechanism during ultrasonic-assisted grinding of C/SiC composites
3天前
已完结
皖公网安备34019202002308
