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110 积分 2025-09-19 加入
Synergistic thermohydraulic design and performance limit of embedded microfluidic chip cooling
19天前
已完结
Path to 3D heterogeneous integration
1个月前
已完结
A review in thermal management for advanced chip packaging from chip to heat sink
6个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
7个月前
已完结
Advancing cooling limits with 3D embedded microchannels
7个月前
已关闭
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