Lv5
1365 积分 2024-03-26 加入
Identification and Predictive Modeling of High Propensity of Defects and Field Failure in Copper-Aluminum Wire Bond Interconnect Under Exposure to High Temperature and Humidity
3个月前
已完结
Multiphysics Model for Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
3个月前
已完结
Grain boundary grooving in bi-crystal thin films induced by surface drift-diffusion driven by capillary forces and applied uniaxial tensile stresses
3个月前
已完结
The effect of thermal grooving on grain boundary motionL'influence d'un sillon thermique sur le mouvement des joints des grainsDer Einfluss einer thermischen Ätzung der korngrenzen auf ihre Wanderung
3个月前
已完结
The effect of stress on grain boundary grooving
3个月前
已完结
Solder joint failures under thermo-mechanical loading conditions – A review
4个月前
已完结
Morphological stability and failure mechanisms for thin metal and barrier films on porous low-κ dielectrics
5个月前
已完结
Failure mechanism and theoretical model of high-temperature tensile creep of sintered nano-silver
5个月前
已完结
Thermomechanical Reliability and Constitutive Investigation of Copper Through-Glass Via in Glass Interposer
6个月前
已完结
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