Lv31
250 积分 2025-09-23 加入
Economic and resilience-oriented operation of coupled hydrogen-electricity energy systems at ports
6小时前
求助中
Modeling and Design for System-Level Reliability and Warpage Mitigation of Large 2.5D Glass BGA Packages
8个月前
已完结
FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages
8个月前
已完结
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
8个月前
已完结
Impact of Copper Through-Package Vias on Thermal Performance of Glass Interposers
8个月前
已完结
Glass for Encapsulating High-Temperature Power Modules
8个月前
已完结
Antenna-Integrated and PA-Embedded Glass Substrates for D-Band InP Power Amplifier Modules
8个月前
已完结