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1070 积分 2023-03-15 加入
Glass‐Ceramic Substrates for Electronics Packaging
9个月前
已完结
Negative thermal expansion ScF3 ceramic for electronic packaging applications
10个月前
已完结
Negative thermal expansion ScF3 ceramic for electronic packaging applications
10个月前
已完结
Multifunctional Screen-Printed Conductive Inks: Design Principles, Performance Challenges, and Application Horizons
1年前
已完结
Heat-Assisted Screen Printing of High-Aspect-Ratio Microstructures
1年前
已完结
Numerical investigation of a Joule-heated catalytic reactor for enhanced ammonia decomposition to hydrogen
1年前
已完结
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