Lv7
4870 积分 2024-05-27 加入
Interconnect
7天前
已完结
Logic Scaling Options for the Next 10 Years: From FinFet to CFET, from Dual Damascene to Semi Damascene
8天前
已完结
Challenges for Leading Edge node FINFET
8天前
已完结
Hafnium Missing Induced SRAM HTOL Fail in Scaled HKMG Technologies
14天前
已完结
Present and Future, Challenges of High Bandwith Memory (HBM)
2个月前
已完结
Reliability Challenges in FinFETs
3个月前
已完结
The FinFET: A Tutorial
4个月前
已完结
Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
4个月前
已完结
29.2 A $\boldsymbol{0.021}\boldsymbol{\mu}\mathbf{m^{2}}$ High-Density SRAM in Intel-18A-RibbonFET Technology with PowerVia-Backside Power Delivery
4个月前
已完结
Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing
4个月前
已完结
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