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4960 积分 2024-05-27 加入
Backside Power Delivery With Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-Filled Slit Nano Through Silicon Vias
8小时前
已完结
29.2 A $\boldsymbol{0.021}\boldsymbol{\mu}\mathbf{m^{2}}$ High-Density SRAM in Intel-18A-RibbonFET Technology with PowerVia-Backside Power Delivery
9小时前
已完结
Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing
9小时前
已完结
Backside Interconnects for Power Delivery – Design, Manufacturability & Yield
9小时前
求助中
Fea of Thermo-Mechanically Induced Cracks in IMD
2个月前
已完结
`Failure analysis of short-circuit failure of metal-oxide-metal capacitor
5个月前
已完结
Dynamic Defect Localization by Toggling Integrated Circuits States
5个月前
已完结
Research on the Functional Failure of Large Scale Chips Caused by Recoverable Latch up
5个月前
已完结
Research on Failure Mechanism of SerDes Phase-Lock-Loop (PLL) Lose Lock
5个月前
已完结
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