Lv61
2230 积分 2020-06-07 加入
Enhanced ablation and dicing process on silicon wafer using experimental passive Q-switch two-micron laser
4个月前
已完结
Two-wavelength digital holography using frequency-modulated continuous-wave technique for multiplexing in the time–frequency domain
9个月前
已完结
Height measurement of solder bumps using two-wavelength parallel four-step phase shifting digital holography
9个月前
已完结
Lateral and axial resolution criteria in incoherent and coherent optics and holography, near- and far-field regimes
10个月前
已完结
Progress and comparison in nondestructive detection, imaging and recognition technology for defects of wafers, chips and solder joints
11个月前
已完结
Wave-activity relation containing wave-basic flow interaction based on decomposition of general potential vorticity*
11个月前
已完结
Enlarged range of measurement method with strong noise resistance for dual-wavelength digital holography
11个月前
已完结
Quantitative assessment of noise reduction with partial spatial coherence illumination in digital holographic microscopy
1年前
已完结
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