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20 积分 2025-10-28 加入
Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels
2小时前
已完结
Integration of Photo-Imaging Technology and Microvias in LTCC for Enhanced High-Frequency Applications and Packaging
2小时前
待确认
Comprehensive Review of Wide-Bandgap (WBG) Devices: SiC MOSFET and Its Failure Modes Affecting Reliability
2个月前
已完结
Feasibility study of wide bandgap power devices in space solar power station applications
2个月前
已完结
Monolithic SiC Smart Power IC with Over-Temperature Protection
2个月前
已完结
Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor
2个月前
已完结
Investigation of the usage of a chip integrated sensor to determine junction temperature during power cycling tests
2个月前
已完结
Chip-level integration of RF MEMS on-chip inductors using UV-LIGA technique
2个月前
已完结
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