Lv1
10 积分 2025-10-28 加入
Characterization of On-Foil Sensors and Ultra-Thin Chips for HySiF Integration
7个月前
已完结
Chip level thermal profile estimation using on-chip temperature sensors
7个月前
已完结
A Compact Hybrid Sensor for Chip-level Online Current Sensing in Press-pack Power Module
7个月前
已完结
A sensor powered by pulsed light (for gas density of GIS)
7个月前
已关闭
Design, simulation and fabrication of liquid cooled LTCC devices utilizing integrated channels
7个月前
已完结
Integration of Photo-Imaging Technology and Microvias in LTCC for Enhanced High-Frequency Applications and Packaging
7个月前
已完结
Comprehensive Review of Wide-Bandgap (WBG) Devices: SiC MOSFET and Its Failure Modes Affecting Reliability
10个月前
已完结
Feasibility study of wide bandgap power devices in space solar power station applications
10个月前
已完结
Monolithic SiC Smart Power IC with Over-Temperature Protection
10个月前
已完结
Early detection of wire bond degradation in IGBT modules using on-chip junction temperature sensor
10个月前
已完结
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