Lv4
650 积分 2020-08-01 加入
Long time reliability study of soldered flip chips on flexible substrates
1天前
求助中
A Direct Multi-Field Coupling Methodology for Modeling Moisture-Induced Stresses and Delamination in Electronic Packages
1天前
已完结
Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack Resistance at TST for Automotive IC Package
1天前
已完结
Recent developments in advanced polymeric materials for solder mask application: Progress and challenges
1天前
已完结
Electrochemical migration of Sn and Sn solder alloys: a review
1天前
已完结
Electrochemical Migration: A Short State-of-the-Art Overview
1天前
已完结
Review—Electrochemical Migration in Electronic Materials: Factors Affecting the Mechanism and Recent Strategies for Inhibition
1天前
已完结
Numerical Models of the Electrochemical Migration: a short review
9天前
已完结
Study of Solder Resist Undercut for Flip Chip Chip Scale Package Substrate
9天前
已完结
Research on BHAST Test Method for Plastic Encapsulated Microcircuit
9天前
已完结
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