Lv4
580 积分 2020-08-01 加入
电迁移现象的机理及其应用研究进展
25天前
已完结
电化学迁移研究进展
25天前
已完结
电化学沉积铜枝晶分形生长及形貌调控研究
25天前
已完结
A novel approach to obtain low-dielectric materials: changing curing mechanism of bismaleimide–triazine resin with ZIF-8
1个月前
已完结
A novel approach to obtain low-dielectric materials: changing curing mechanism of bismaleimide–triazine resin with ZIF-8
1个月前
已完结
阻焊油墨结构对其性能及可靠性的影响
2个月前
已完结
Study on the hygrothermal aging mechanism of photo-thermal dual-curing solder mask
2个月前
已完结
Balancing mechanical and thermal properties in epoxy-based solder resists through polyurethane-polyimide hybrids
2个月前
已关闭
Polyurethane-Modified Acrylic Resins: High-Adhesion and Low-Dielectric Solder Resists for Advanced Packaging
2个月前
已完结
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