Lv4
570 积分 2024-09-06 加入
In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys
16天前
已完结
Effects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder
20天前
已完结
Wettability of electroless Ni in the under bump metallurgy with lead free solder
20天前
已完结
Wave/Selective Soldering
21天前
已完结
Effects of Tellurium addition on the microstructural evolution and properties of Sn-0.7Cu lead-free solder alloy
23天前
已完结
Effects of trace addition of Fe on the thermal, microstructure, and tensile creep properties of Sn-0.7Cu eutectic alloy
23天前
已完结
Screening corrosion-resistant genetic elements of Sn-0.7Cu solders by high-throughput calculations
23天前
已关闭
Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders
23天前
已完结
Härteprüfung nach Vickers
28天前
已完结
Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing
29天前
已完结
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