Lv4
570 积分 2024-09-06 加入
In situ study on growth behavior of Cu6Sn5 during solidification with an applied DC in RE-doped Sn–Cu solder alloys
18天前
已完结
Effects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder
22天前
已完结
Wettability of electroless Ni in the under bump metallurgy with lead free solder
22天前
已完结
Wave/Selective Soldering
22天前
已完结
Effects of Tellurium addition on the microstructural evolution and properties of Sn-0.7Cu lead-free solder alloy
24天前
已完结
Effects of trace addition of Fe on the thermal, microstructure, and tensile creep properties of Sn-0.7Cu eutectic alloy
24天前
已完结
Screening corrosion-resistant genetic elements of Sn-0.7Cu solders by high-throughput calculations
24天前
已关闭
Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders
24天前
已完结
Härteprüfung nach Vickers
29天前
已完结
Addition of cobalt nanoparticles into Sn‐3.8Ag‐0.7Cu lead‐free solder by paste mixing
30天前
已完结
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