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296 积分 2023-11-03 加入
Efficient Chip-Integrated Microfluidic Cooling Through Jet-Enhanced Manifold Microchannels
14天前
已完结
Experimental Investigation of Single-Phase Cooling in Embedded Microchannels: 3D Manifold Heat Exchanger With R-245fa
1个月前
已完结
Three-Tier Hierarchical Porous Structure with Ultrafast Capillary Transport for Flexible Electronics Cooling
2个月前
已完结