SciHub
文献互助
期刊查询
一搜即达
科研导航
交流社区
登录
注册
发布
文献
求助
首页
我的求助
捐赠本站
端庄的正豪
Lv1
30 积分
2023-10-24 加入
最近求助
最近应助
互助留言
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
1个月前
已完结
Study on the properties of low silver Sn1.0Ag0.5Cu composite solder reinforced with nickel-plated zinc oxide and its soldering joint
1个月前
已完结
High-Temperature Thermal–Electrical Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints
1个月前
已完结
Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints
1个月前
已完结
Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
1个月前
已完结
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint
1个月前
已完结
Modern Trends in Microelectronics Packaging Reliability Testing
1个月前
已完结
Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing
1个月前
已完结
An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints
1个月前
已完结
Effects of Nanoparticle Addition on the Reliability of Sn-Based Pb-Free Solder Joints Under Various Conditions: A Review
1个月前
已完结
没有进行任何应助
感谢
1个月前
感谢
1个月前
感谢
1个月前
感谢
1个月前
感谢
1个月前
感谢
1个月前
感谢
1个月前
感谢
1个月前
感谢
1个月前
感谢
1个月前
最近帖子
最近评论
没有发布任何帖子
没有发布任何评论