Lv11
30 积分 2025-12-11 加入
Effect of organic additives on structure, resistivity, and room-temperature recrystallization of electrodeposited copper
3小时前
待确认
Effect of Different Ni Contents on Thermal Stability of Cu(Ni) Alloy Film
2个月前
已完结
Electrodeposition of Copper-Nickel Alloys from a Citrate Bath Containing Boric Acid
2个月前
已完结
Direct-Write Printing Copper–Nickel (Cu/Ni) Alloy with Controlled Composition from a Single Electrolyte Using Co-Electrodeposition
2个月前
已完结
Direct-Write Printing Copper–Nickel (Cu/Ni) Alloy with Controlled Composition from a Single Electrolyte Using Co-Electrodeposition
2个月前
已完结
Direct-Write Printing CopperNickel (Cu/Ni) Alloy with Controlled Composition from a Single Electrolyte Using Co-Electrodeposition
2个月前
已完结
High speed Cu-Ni filling into TSV for 3-Dimensional Si chip stacking
2个月前
已完结
Obtention and characterisation of cobalt+copper electrodeposits from a citrate bath
8个月前
已完结
All-wet TSV filling with highly adhesive displacement plated Cu seed layer
8个月前
已完结
The effect of tungsten and boron on the Cu barrier and oxidation properties of thin electroless cobalt–tungsten–boron films
8个月前
已完结
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