Lv4
414 积分 2023-10-19 加入
Ultrafast laser-induced internal modifications and cross-scanning strategy for material-efficient 4H-SiC slicing
4小时前
待确认
Crack propagation mechanisms in laser slicing of 4° off-axis 4H-SiC and separation strength regulation via multi-beam processing
2个月前
已完结
Material properties and grinding mechanism of SiC laser slicing wafers
2个月前
已完结
Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test
3个月前
已完结
Fracture Strength of Single-Crystal Silicon Carbide Microspecimens at 24 $^{\circ}\hbox{C}$ and 1000 $^{\circ}\hbox{C}$
4个月前
已完结
Surface roughness optimization in processing SiC monocrystal wafers by wire saw machining with ultrasonic vibration
4个月前
已完结
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