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200 积分 2024-09-11 加入
Electrodeposition of metals and alloys—new results and perspectives
3小时前
已完结
Oxidation and Corrosion Resistance of Nanocrystalline Copper Deposit Produced by Pulse Electrodeposition
20天前
已完结
Oxidation and Corrosion Resistance of Nanocrystalline Copper Deposit Produced by Pulse Electrodeposition
24天前
已完结
Active Learning for the Discovery of Binary Intermetallic Compounds as Advanced Interconnects
1个月前
已完结
Active Learning for the Discovery of Binary Intermetallic Compounds as Advanced Interconnects
1个月前
已关闭
Isothermal aging and electromigration reliability of Cu pillar bumps interconnections in advanced packages monitored by in-situ dynamic resistance testing
7个月前
已完结
Microstructure and properties of AgCu/2 wt% Ag-added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering
7个月前
已完结
Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding
7个月前
已完结
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