Lv4
608 积分 2024-09-11 加入
Curvature Enhanced Adsorbate Coverage Model for Electrodeposition
2个月前
已完结
Structural and Electrical Properties of an Electrolyte-insulator-metal Device with Variations in the Surface Area of the Anodic Aluminum Oxide Template for pH Sensors
2个月前
已完结
The Change of Mechanical Properties for Anodic Aluminum Oxide by Heat Treatment
2个月前
已完结
Integrated Electrochemical and Computational Elucidation of Nitro Blue Tetrazolium Chloride as an Efficient Leveler for Copper Microvia Superfilling
3个月前
已完结
Vibrational Spectroscopic and Mass Spectrometric Studies of the Interaction of Bis(3-sulfopropyl)-disulfide with Cu Surfaces
3个月前
已完结
Electrodeposition of Cu in the PEI-PEG-Cl-SPS Additive System
3个月前
已完结
Effect of Cl[sup −] on the Adsorption–Desorption Behavior of PEG
5个月前
已完结
Interfacial Leveler-Accelerator Interactions in Cu Electrodeposition
5个月前
已完结
Copper Deep Via Filling with Selective Accelerator Deactivation by Polyethyleneimine
5个月前
已完结
The Adsorption Structure of Polyethylene Imine on Copper Surfaces for Electrodeposition
5个月前
已完结
皖公网安备34019202002308
