Lv3
360 积分 2024-09-12 加入
Low magnetic field alignment of carbon fibers in a polymer matrix for high-performance thermal interface materials
5个月前
已完结
A flexible thermal interface composite of copper-coated carbon felts with 3d architecture in silicon rubber
5个月前
已完结
Significantly improved thermal conductivity of C/C composite by constructing 3D SiC nanowires network in carbon felt via vacuum thermal evaporation
5个月前
已完结
2D materials-based thermal interface materials: Structure, properties, and applications
6个月前
已完结
The preparation and feasibility analysis of magnetic orientation method in the study of thermal insulation composite materials in the field of electronic packaging
8个月前
已完结
Vertical particle alignment of boron nitride and silicon carbide binary filler system for thermal conductivity enhancement
8个月前
已完结
Preparation processes and thermal conductivities of magnetic field- and torsional vibration-induced superoriented carbon fiber composites
9个月前
已完结
Magnetic aligned AlN/epoxy composite for thermal conductivity enhancement at low filler content
9个月前
已完结
An efficient thermal interface material with anisotropy orientation and high through-plane thermal conductivity
10个月前
已完结
Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application
10个月前
已完结
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