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40 积分 2025-05-11 加入
Flexible packaging and integration of CMOS IC with elastomeric microfluidics
1个月前
已完结
A Bilayer Microfluidics-Based Elastic Encapsulation Method of Liquid Metal Circuits with Cellular Resolution
1个月前
已完结
Direct writing of electronics based on alloy and metal (DREAM) ink: A newly emerging area and its impact on energy, environment and health sciences
1个月前
已完结
Encapsulation of Liquid Metal Particles for Next-Generation Stretchable Electronics
1个月前
已关闭
Functionalisation of liquid metal droplets by surface and interface engineering and electrification
2个月前
已完结
Research on reversible bonding of microfluidic chips based on stretch release adhesive strips
3个月前
已完结
Reversible bonding of microfluidics: Review and applications
3个月前
已完结
Fabrication methods and applications of microstructured gallium based liquid metal alloys
3个月前
已完结
A review of liquid metal-based flexible electronics achieved by ultrafast lasers
3个月前
已完结
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