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10 积分 2025-04-24 加入
Mitigation of self-heating in AlGaN/GaN HEMTs using transferred LPCVD-grown h-BN
1年前
已完结
A perspective on diamond heterojunction devices
1年前
已完结
Improving the interfacial thermal conductance between Cr–Ni alloy and dielectric by a metal interlayer
1年前
已完结
Carbon Nanostructure–Enabled High‐Performance Thermal Insulation for Extreme‐Temperature Application
1年前
已完结
Advanced Thermal Interface Materials: Insights into Low‐Temperature Sintering and High Thermal Conductivity of MgO
1年前
已完结
Energy-efficient cooling of silicon-based microfluidic chips enabled by integrated microstructural and surface modification strategies
1年前
已完结
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