Lv0
0 积分 2025-04-24 加入
Carbon Nanostructure–Enabled High‐Performance Thermal Insulation for Extreme‐Temperature Application
7小时前
待确认
Advanced Thermal Interface Materials: Insights into Low‐Temperature Sintering and High Thermal Conductivity of MgO
7小时前
待确认
Energy-efficient cooling of silicon-based microfluidic chips enabled by integrated microstructural and surface modification strategies
5天前
已完结
Metasurfaces Assisted Twisted α-MoO3 for Spinning Thermal Radiation
4个月前
已完结
Enhanced chirality induced in a composite structure consisting of α-MoO3 film and a silver metasurface
4个月前
已完结
Lithography-Free Solar Absorber Made of Multilayer w/SiO2 for Efficient Photothermal Conversion
4个月前
已完结
皖公网安备34019202002308
