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35 积分 2021-11-20 加入
3D interconnects for III-V semiconductor heterostructures for miniaturized power devices
4个月前
已完结
一种晶硅太阳能电池电场辅助激光烧结的方法
6个月前
已完结
All-in-one, bio-inspired, and low-power crypto engines for near-sensor security based on two-dimensional memtransistors
11个月前
已完结
All-in-one two-dimensional retinomorphic hardware device for motion detection and recognition
11个月前
已完结
2D materials for future heterogeneous electronics
11个月前
已完结
Recent progress in the development of RE2TMTM’O6 double perovskite oxides for cryogenic magnetic refrigeration
1年前
已完结
Non-Fluorinated Flexible Superhydrophobic Surface with Excellent Mechanical Durability and Self-Cleaning Performance
1年前
已完结
Mechanical Behavior at Graphene/Polymer Interfaces Under Biaxial Compression
1年前
已完结
Folding and crumpling of graphene under biaxial compression
1年前
已完结
Tuning the Optical, Magnetic, and Electrical Properties of ReSe2 by Nanoscale Strain Engineering
1年前
已完结
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