Lv2
130 积分 2022-07-23 加入
Dielectric breakdown of oxide films in electronic devices
6小时前
待确认
Characterization and Multiscale Modeling of TDDB in State-of-the-art BEOL
7小时前
待确认
Identifying the weakest interface in BEOL structures
7小时前
已完结
A Unified TDDB Model for BEOL Dielectrics of Various Structures and Thick FEOL Dielectrics
7小时前
待确认
2024 IEEE International Reliability Physics Symposium (IRPS 2024)
8小时前
已完结
Dielectric Properties Investigation of Metal–Insulator–Metal (MIM) Capacitors
2天前
已完结
Reliability and Risk Analysis
3个月前
已完结
An introduction to Cu electromigration
6个月前
已完结
Using line-length effects to optimize circuit-level reliability
6个月前
已完结
Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees
6个月前
已完结
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