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70 积分 2020-04-09 加入
A high entropy alloy as very low melting point solder for advanced electronic packaging
3年前
已完结
Toxic materials released from photovoltaic modules during fires: Health risks
3年前
已完结
The Effect of Ageing on the Microstructure of 60:40 Tin‐lead Solders
3年前
已完结
Strain Partitioning and Softening Mechanisms of δ/γ in Lean Duplex Stainless Steels during Hot Deformation
4年前
已完结
The effects of thermo-mechanical treatments on superplasticity of Fe-24Cr-7Ni-3Mo-0.14N duplex stainless steel
4年前
已关闭
Hot deformation characteristics of 2205 duplex stainless steel based on the behavior of constituent phases
4年前
已完结
Physical true random number generator
4年前
已完结
Influence of microstructure on the flow behavior of duplex stainless steels at high temperatures
4年前
已完结
Hot deformation of duplex stainless steels
4年前
已完结
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