数码产品
小型化
电力电子
热导率
材料科学
电子设备和系统的热管理
散热膏
消散
热阻
工程物理
机械工程
电子包装
热的
电气工程
纳米技术
工程类
复合材料
物理
热力学
电压
作者
Wenkui Xing,Yue Xu,Chengyi Song,Tao Deng
出处
期刊:Nanomaterials
[MDPI AG]
日期:2022-09-27
卷期号:12 (19): 3365-3365
被引量:19
摘要
With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.
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