| 标题 |
Development of Glass-Substrate-Based MEMS Micro-Hotplate with Low-Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow |
| 网址 | |
| DOI | |
| 其它 |
期刊:2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS) 作者:Honglin Qian; Haotian Dai; Fanhong Chen; Shuai Liu; Xiaohui Du; et al 出版日期:2024-02-22 |
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(2025-6-4)