扇出
扇入
嵌入式系统
包对包
灵活性(工程)
芯片级封装
互连
可靠性(半导体)
芯片上的系统
晶圆级封装
成套系统
摩尔定律
晶圆规模集成
计算机科学
薄脆饼
炸薯条
电子工程
工程类
计算机体系结构
电气工程
功率(物理)
操作系统
电信
量子力学
数学
晶片切割
物理
统计
作者
Chien-Fu Tseng,Chung-Shi Liu,Chi-Hsi Wu,Douglas W. Yu
出处
期刊:Electronic Components and Technology Conference
日期:2016-05-01
被引量:155
摘要
A powerful integrated fan-out (InFO) wafer level system integration (WLSI) technology has been developed to integrate application processor chip with memory package for smart mobile devices. This novel InFO technology is the first high performance Fan-Out Wafer Level Package (FO_WLP) with multi-layer high density interconnects proposed to the industry. In this paper we present the detailed comparison of InFO packages on package (InFO_PoP) with several other previously proposed 3D package solutions. Result shows that InFO_PoP has more optimized overall results on system performance, leakage power and area (form factor) than others, to meet the ever-increasing system requirements of mobile computing. InFO technology has been successfully qualified on package level with robust component and board level reliability. It is also qualified at interconnect level with high electromigration resistance. With its high flexibility and strong capability of multi-chips integration for both homogeneous and heterogeneous sub-systems, InFO technology not only provides a system scaling solution but also complements the chip scaling and helps to sustain the Moore's Law for the smart mobile as well as internet of things (IoT) applications.
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