金属间化合物
焊接
材料科学
微观结构
接头(建筑物)
脆性
图层(电子)
冶金
剪切(地质)
抗剪强度(土壤)
复合材料
结构工程
环境科学
合金
土壤科学
工程类
土壤水分
作者
Xi Huang,Liang Zhang,Jiamin Zhang,Chen Chen,Xiaoping Lu,Lei Sun
标识
DOI:10.1016/j.matchar.2023.113618
摘要
The microstructure and intermetallic compound (IMC) growth in Sn58Bi/Cu and Sn58Bi-0.4 Mg/Cu solder joints were examined in this study under varied thermal aging time (6, 12, 18, 24, and 30 h) at 120 °C. The Shear test was conducted to assess the solder joint mechanical performance. The results indicated that the precipitation of the Bi phase in Sn58Bi/Cu and Sn58Bi-0.4 Mg/Cu solder joints was not significantly inhibited by adding Mg as aging time increased. The IMC layer thickness of both solder joints increased as the aging time increased, but the Cu3Sn IMC thickness in Sn58Bi-0.4 Mg/Cu solder joint was consistently thinner than that in Sn58Bi/Cu joint. The temporal evolution of the Cu3Sn IMC layer was investigated, and it was found that the inclusion of Mg particles reduced the diffusion coefficient of Cu3Sn IMC. Furthermore, the shear test revealed that throughout the initial phases of thermal aging, fractures occurred within the solder matrix for both joints. As thermal aging time increased, fractures extended into the IMC layer, accompanied by transgranular and intergranular fractures. Simultaneously, adding Mg particles delayed brittle fracture in the solder joints, enhancing their mechanical properties.
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