Low‐cost metallization based on Ag/Cu fingers for exceeding 25% efficiency in industrial silicon heterojunction solar cells

Although Ag‐coated Cu technology is considered to be an effective approach to mitigate the metallization expenses associated with silicon heterojunction (SHJ) solar cells, there is limited reporting on the photovoltaic performance and reliability of devices employing Ag/Cu electrodes. Here we have successfully fabricated industrial SHJ solar cells, yielding an average efficiency of 25.18% with bifacial Ag/Cu fingers, which caused a 0.13% decline in efficiency but saved 46% in Ag consumption when compared to traditional Ag fingers. Performance degradation is demonstrated to originate essentially from the front rather than rear Ag/Cu fingers, as revealed by a comprehensive analysis of resistance enhancement and optical loss. Notably, the Ag/Cu fingers exhibit a 1.4% lower printed qualification rate and similar high‐temperature stability in contrast to Ag fingers. Our results provide valuable insights for further optimization of low‐cost and high‐efficiency SHJ solar cells based on Ag/Cu electrodes. This article is protected by copyright. All rights reserved.